Rapid peneteration of bismuth from solid Bi2Te3 along grain boundaries in Cu and Cu – based alloysстатья
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Дата последнего поиска статьи во внешних источниках: 7 декабря 2017 г.
Аннотация:As well known, bismuth rapidly penetrates into
copper grain boundaries at about 550 C and embrittles
copper. In the experiments, the authors have used solid
Bi2Te3 for the embrittlement of pure copper and copperbased
solid solutions containing iron and silver. The
investigated alloys were heated in the closed volume
together with Bi2Te3 for a short time (5–90 min) at 570 C
in the hydrogen atmosphere. Bi2Te3 did not contact with
copper samples during annealing. After that, the samples
were bent and grain boundary cracks were formed (with the
depth about 10–500 lm). Experiment showed that silver
accelerates the embrittlement in the contrast to iron. The
cracks in the silver–copper alloys were deeper than in the
iron–copper ones. It was assumed that the depth of cracks
is equal to the penetration depth. The reasons for this
phenomenon were discussed in terms of the impurities
effect on the grain boundary segregation.